Factory Address: No. A219-2, 2F, Building B, Da Hong Science Park, Xia lang Industrial Zone, He shui kou Community, Gong ming Street, Guang ming New district, Shenzhen City, China ZIP: 518106
Fleconn offers a wide variety of Board-to-Board Connectors for high-speed, high-density, and high-power applications. Examples include stacking, mezzanine, coplanar, and orthogonal connectors.
Micro-Fit 3.0™ connectors are a 3.00mm pitch high-density,
low-power connector system available in wire-to-wire and wire-to-board configurations with
SMT and through-hole options and up to 5.0A to meet low- to mid-range power application needs
Its plug consists of a unique flexible hinge that absorbs circuit board misalignment.
*Low profile
Only 5.0mm in mounting height
*The flexible construction of the plug allows it to be mated after its PC boards are mounted in their enclosures.